Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
Key Properties
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Exceptional Interconnect Reliability
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Horizontal or vertical application
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Excellent bath stability and performance
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Reduced bath maintenance
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Reduction in solution volume growth
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Low-build or high-build deposition
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PCB/FPC用(yong)高TP值(zhi)VCP酸性(xing)鍍銅(tong)光亮(liang)劑中(zhong)間體(ti)産品(pin)介紹(shao)：
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2021年度(du)填孔(kong)鍍銅(tong)——印刷(shua)線路(lu)闆（PCB，FPC）酸(suan)性填(tian)孔鍍(du)銅中(zhong)間體(ti)：
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