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新(xin)材料科(ke)技與化(hua)學技術(shu)創新

安(an)美特Atotech新(xin)品介紹(shao)——Adhemax NiLow無氨化(hua)學鎳添(tian)加劑

Adhemax®NiLow – 用(yong)于塑料(liao)電鍍的(de)無氨化(hua)學鎳 Ammonia-free electroless nickel process for plating on plastics   高(gao)濃度的(de)氨氮是(shi)化學鎳(nie)廢水難(nan)于處理(li)的重要(yao)原因之(zhi)一,氨氮(dan)超标排(pai)放會對(dui)魚類等(deng)水生生(sheng)物造成(cheng)毀滅性(xing)打擊,近(jin)年來國(guo)家對氨(an)氮的排(pai)放限制(zhi)愈發嚴(yan)格,中國(guo)電鍍排(pai)放标準(zhun)中對氨(an)氮的排(pai)放上限(xian)已經降(jiang)至 8 ppm。 High concentration of ammonia & nitrogen is very difficult to be treated in EN wastewater, and its excessive emission will cause devastating strikes to aquatic organisms. Therefore, the restriction on ammonia & nitrogen emission becomes much stricter worldwide in recent years. The upper limit of ammonia & nitrogen in Chinese Emission Standards for electro-plating has been reduced to 8 ppm.   氨氮(dan)作爲化(hua)學鎳的(de)重要組(zu)分之一(yi),具備絡(luo)合、穩定(ding)和緩沖(chong)的作用(yong),性能優(you)異,幾乎(hu)無可取(qu)代。 “隻要(yao)做塑料(liao)電鍍,就(jiu)難以繞(rao)開化學(xue)鎳;隻要(yao)用化學(xue)鎳,就難(nan)以回避(bi)氨氮問(wen)題。” 長久(jiu)以來,這(zhe)個矛盾(dun)都看似(si)無法調(diao)和。 As one of the important components of electroless nickel, ammonia is almost irreplaceable with its ability of excellent complexing, stabilizing and buffering. ‘Electroless nickel could not be avoided when plating on plastics, while ammonia could not be avoided when using electroless nickel.’  This conflict seems inevitable for a long time.   Adhemax®NiLow無氨(an)化學鎳(nie)工藝是(shi)安美特(te)NiLow系列最(zui)新的研(yan)發成果(guo),至今已(yi)在全球(qiu)多個國(guo)家實現(xian)工業化(hua)應用,在(zai)中國某(mou)家大型(xing)汽車配(pei)件供應(ying)商實現(xian)量産,用(yong)于ABS和ABS/PC素(su)材,其優(you)良的穩(wen)定性和(he)可靠性(xing)得到了(le)客戶的(de)認可。 Adhemax®NiLow is the latest improved version on basis of Atotech NiLow series and has been used in many countries worldwide. In China, Adhemax® NiLow has gone into mass production successfully in a large automotive supplier and its stability and reliability for ABS and ABS/PC was highly praised by customer.   安(an)美特Adhemax®NiLow用(yong)于塑料(liao)的無氨(an)化學鎳(nie)的主要(yao)特點如(ru)下: 1. 高穩(wen)定性,可(ke)以24小時(shi)連續生(sheng)産; 2. 整個(ge)使用周(zhou)期氨氮(dan)排放爲(wei)0; 3.  應用于(yu)ABS和ABS/PC素材(cai); 4. 不含氨(an)氮,不含(han)鉛,不含(han)硼酸; 5. 易(yi)于操作(zuo)和控制(zhi),操作溫(wen)度30-40℃。 Atotech Adhemax®NiLow is an ammonia free electroless nickel for plating of plastics, the main features are as below:     1.    High stability, suitable for continuously production.           2.   Zero emission of ammonia & nitrogen.     3.    Suitable for ABS and ABS/PC materials.     4.    Free of ammonia & nitrogen, lead and boric acid.     5.    Easy to operate and control, can be used at low temperature (30-40℃).

發布(bu)時間:

2025-11-22

垂直(zhi)連續電(dian)鍍(VCP)高TP值(zhi)酸性鍍(du)銅光澤(ze)劑用電(dian)鍍中間(jian)體

印刷(shua)電路闆(pan)(Printed-Circuit-Board,PCB)是電子(zi)産品的(de)必要組(zu)成部分(fen),是承載(zai)電子産(chan)品中電(dian)子元件(jian)的母闆(pan)。目前,電(dian)子産品(pin)快速向(xiang)小型化(hua)、便捷化(hua)、智能化(hua)方向發(fa)展,擁有(you)高連通(tong)密度的(de)多層印(yin)刷電路(lu)闆(HDI-PCB)和柔(rou)性電路(lu)闆(Flexible Printed Circuit Board,FPC,亦稱(cheng)軟闆)是(shi)制造這(zhe)些電子(zi)産品的(de)重要部(bu)件之一(yi)。在多層(ceng)電路闆(pan)和軟闆(pan)中使用(yong)金屬化(hua)的通孔(kong)或盲孔(kong)來實現(xian)不同層(ceng)之間的(de)導通。通(tong)孔電鍍(du)銅是實(shi)現通孔(kong)金屬化(hua)的重要(yao)途徑,也(ye)是多層(ceng)PCB和FPC制作(zuo)過程中(zhong)非常重(zhong)要的一(yi)項技術(shu)。但是在(zai)直流電(dian)鍍過程(cheng)中,由于(yu)通孔内(nei)的電流(liu)密度分(fen)布不均(jun)勻,使用(yong)傳統鍍(du)液很難(nan)在孔内(nei)得到厚(hou)度均勻(yun)的鍍層(ceng),而使用(yong)有機添(tian)加劑是(shi)一個有(you)效而且(qie)經濟的(de)方法。所(suo)以,開發(fa)出有效(xiao)而且穩(wen)定性、适(shi)應性強(qiang)的通孔(kong)電鍍添(tian)加劑是(shi)非常必(bi)要的。

發(fa)布時間(jian):

2025-11-22

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