Circuposit™ 3000-1 from Dupont Dow Rhom Hass Company

Circuposit™ 3000-1 Electroless Copper is a unique, patented process that is widely used by leading PCB fabricators throughout the world. This novel self-accelerating electroless copper eliminates the need for a separate accelerator step, saving space and improving quality and control. The 3350-1 electroless copper bath is formulated to provide improved physical properties and produce exceptionally fine-grain, low-stress deposits, which yield enhanced hole-wall coverage and excellent adhesion even on the most demanding high-performance substrates.
 

Key Properties

• Exceptional Interconnect Reliability
• Horizontal or vertical application
• Excellent bath stability and performance
• Reduced bath maintenance
• Reduction in solution volume growth
• Low-build or high-build deposition
   

酸性鍍銅(tong)中間體相關(guan)鏈接：

垂直連(lian)續電鍍（VCP）高TP值(zhi)酸性鍍銅光(guāng)澤劑用電鍍(du)中間體： benxiaohai.cc/news/170.html
 

PCB/FPC用高(gāo)TP值VCP酸性鍍銅(tóng)光亮劑中間(jiān)體産品介紹(shào)： benxiaohai.cc/news/30.html
 

2021年度填孔鍍(du)銅——印刷線路(lu)闆（PCB，FPC）酸性填孔(kǒng)鍍銅中間體(tǐ)： benxiaohai.cc/news/283.html

 

2021年國際表面(miàn)處理展電子(zǐ)展廳：

深圳市(shì)同泰化學技(ji)術有限公司(si)參加了2021年7月(yue)26-28日在廣州保(bǎo)利🌈世貿博覽(lan)館舉辦的第(di)十四屆廣州(zhou)國際表面處(chu)理、電鍍、塗裝(zhuāng)展覽📧會，誠邀(yao)您莅臨同泰(tài)化學電子展(zhǎn)廳參觀指導(dǎo)！電子展廳鏈(lian)接：benxiaohai.cc/news/316.html 。